At a time when NVIDIA uses liquid metal in video cardsAMD saves solder and coats the processor crystals with thermal paste. Of course, it gets very hot.
Chinese enthusiasts have reviewed the Ryzen 5 7400F chip. Tests showed performance at 7500F when the processor has no temperature limitations. Further testing with the cover removed revealed that AMD had opted for a simple thermal paste instead of the traditional thermal interface — solder (STIM) between the heat spreader and the processor crystals. The low price of the processor ($115) surely required some sacrifices.
Last month, AMD quietly released the six-core Ryzen 5 7400F, which became the most affordable Raphael processor for consumers. The difference between the 7400F and 7500F is the lower binning (selection criterion), which is reflected in the clock speed. The Ryzen 5 7400F offers six cores and twelve threads based on the AMD Zen 4 architecture. The use of Raphael cores provides 32 MB of L3 cache and 6 MB of L2 cache with a base TDP of 65W (88W PPT). The 7400F has a base frequency of 3.7 GHz that reaches 4.7 GHz under load, — 300 MHz less than the 7500F.
The test bench included the Ryzen 5 7400F combined with DDR5-6000 CL36 memory on an MSI MPG 850 Edge Ti WiFi motherboard. With all the default settings and only the EXPO profile enabled, the Ryzen 5 7400F is 6% slower than the 7500F in the Cinebench R23 single-core test.
With default consumption, the 7400F easily reaches Tjmax (95°C) with liquid cooler, which is a direct result of the worse thermal interface. When the power consumption rises to about 100W, the processor heats up to 105°C and shuts down immediately. After manually adjusting the voltage and frequency in the BIOS, the chip operated at 5.05 GHz with a temperature of 96 °C.
Source: Tom`s Hardware
Spelling error report
The following text will be sent to our editors: